mb1s-MB10S 0.6 ? 0.1 3.8 ? 0.2 4 . 6 ? 0 . 2 2 . 5 ? 0.2 2.5 ? 0. 25 0.3 ? 0.1 6.8 ? 0.2 1 . 2 ? 0.2 1.0 ? 0.15 dimensions in millimeters features this series is ul recognized under component index, f ile n u m ber e 239431 glass passivated chip junctions plastic materrial has u/l flammability classification 94v-o mechanical data maximum ratings and electrical characteristics ratings at 25 ambient temperature unless otherwise specified. single phase,half wave,60 hz,resistive or inductive load. for capacitive load,derate by 20%. units m a x i m u m r e c u r r e n t p eak r e v e r s e v o l t a g e v m a x i m u m r m s v o l t a g e v m a x i m u m d c b l o c k i ng v o l t a ge v maximum average forw ard output current @t a =25 peak forw ard surge current 8.3ms single half-sine-w ave superimposed on rated load maximum instantaneous forw ard voltage @ 0 .4 a v maximum reverse current @t a =25 a at rated dc blocking voltage @t a =100 ma t y p i c a l j u n c t i on c a p a c i t a n c e p e r l eg ( n o t e 3) pf operating junction temperature range storage temperature range notes: (1) on glass epoxy p.c.b. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads (2) on aluminum substrate p.c.b. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) sold er pad (3) measured at 1.0 mhz and applied rev erse v oltage of 4.0 volts t stg t j v rrm 0 . 5 1) 0 . 8 2) c j 13 i r v f i fsm i f(av) 3 5 .0 v dc v r m s 1000 70 140 280 420 560 700 400 saves space on printed circuit boards weight: 0.0078 ounce, 0.22 gram polarity: polarity symbols marked on body dimensions in inches and (millimeters) case: molded plastic body over passivated junctions terminals: plated leads solderable per mil-std-750, method 2026 high s u r ge o v e r load r a t i ng: 3 5 a peak high temperature soldering guaranteed: mounting position: any 260c/10 seconds at 5 lbs. (2.3kg) tension v o l t a g e r a n g e : 50 --- 1 0 0 0 v current: 0.5 a 5 . 0 1000 1.0 35 50 100 200 a mb05s mb 1 s mb2s mb4s mb6s mb8s MB10S 0.5 - 5 5 -- - - + 150 - 55 ---- + 150 a /w 800 800 600 mbs 50 100 200 400 600 typical thermal resistance pe r leg (note 1 ) r | ja 85 (note 2 ) r | jl 20 xinghe electronics e?o?? gaomi xinghe electronicsco.,ltd. www.sddzg.com tel:0536-2210359 qq:464768017 1
2 .2 2 1 .1 4 .4 1.0 2 40 10 20 60 100 4 10 20 40 100 f=1mhz t j =25 0.1 1 0.01 1.4 10 1.2 0.8 1.0 0.4 0.6 0.2 t j =25 pulse width=300 s 110100 5.0 35 10 30 25 20 15 0 t a = 40 single half sine-wave (jedec method) 1.0 cycle f=60hz f=50hz .01 0 0.1 1.0 10 100 80 60 40 20 100 t j =25 t j =125 resistive or inductive load g l a s s epoxy p.c.b. 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 30 60 90 120 150 fi g.2 -- maxi mum non-repeti tive peak forward surge current per leg peak forward surge current, amperes amperes micro amperes fig. 1 -- derati ng curve for output r recti fi ed current capacitance, pf ambient t e m pe r a t ur e , fig. 4 -- typi cal reverse characteri sti c number of cycles at 50/60hz reverse voltage, volts pe rc e n t o f r a t ed peak r eve r se v o l t a g e ,% fig. 5 -- typi cal juncti on capaci tance per bbbbbbb element instantaneous reverse current, instantaneous forward voltage, volts instantaneous forward current , average forward current, amperes fig. 3 -- typi cal forward voltage kkkk characteri sti cs per leg aluminum substrate 1. m t e l : 0 5 3 6 - 2 8 6 6 2 6 2 6 2 6 2 mb1s-MB10S v o l t a g e r a n g e : 50 --- 1 0 0 0 v current: 0.5 a xinghe electronics e?o?? gaomi xinghe electronicsco.,ltd. www.sddzg.com tel:0536-2210359 qq:464768017
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